微小互连高度对倒装芯片组装焊点显微组织及力学性能的影响. (Chinese)
- Resource Type
- Article
- Authors
- 尚拴军; 崔 凯; 赵亚涛; 侯趁意; 陈 帆
- Source
- Electronic Components & Materials; apr2019, Vol. 38 Issue 4, p37-41, 5p
- Subject
- Language
- Chinese
- ISSN
- 10012028
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