挠性印制电路板细线路微蚀及化学镀镍工艺研究. (Chinese)
- Resource Type
- Article
- Authors
- 秦伟恒; 郝志峰; 胡光辉; 罗继业; 陈相; 王吉成; 徐欣移
- Source
- Electroplating & Finishing; 2024, Vol. 43 Issue 4, p1-8, 8p
- Subject
- Language
- Chinese
- ISSN
- 1004227X
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