High power multichip modules employing the planar...
- Resource Type
- Article
- Authors
- Hahn, Robert; Kamp, Andreas; Ginolas, Arnim; Schmidt, M.; Wolf, Jü&rgen; Glaw, Veronika; Töpper, Michael; Ehrmann, Oswin; Reichl, Herbert
- Source
- IEEE Transactions on Components, Packaging & Manufacturing Technology, Part A. Dec97, Vol. 20 Issue 4, p432. 10p. 6 Black and White Photographs, 5 Charts, 13 Graphs.
- Subject
- *MULTICHIP modules (Microelectronics)
*ELECTRONIC packaging
*PACKAGING
- Language
- ISSN
- 1070-9886
Describes a novel packaging technology for high power multichip modules (MCM). Material parameters for simulation; Advantage of the planar embedding technology; Methods tested for the module-heat sink attachment; Conclusion.