A temperature and humidity-controlled test bench for a wirelessly-powered ultra-low-power temperature sensor IC is presented. It consists of a closed metallic structure of 0.02 m3, forming a faraday-cage around the design under test (DUT), thermally insulated using Polyethylene foam, to provide electromagnetic interference (EMI) clean and thermally stable test environment with an operating temperature range of -10 °C to 100 °C. The temperature control with a settling accuracy of ± 0.6 °C is achieved with air-cooled 100 W Peltier modules, having fast dynamics to reach 95% of the required temperature within 15 min. The humidity is controlled by air circulation through a desiccant pocket, managed at around 15% to avoid water droplets during defrosting. A controllable vacuum of ~ 1.3 kPa is achieved through a vacuum pump when < 15% of de-humification is needed. The system operates at a lower power consumption of 30 W during the temperature retention phase, with acoustic noise of 58 dB-SPL achieved. [ABSTRACT FROM AUTHOR]