Currently, the PTFE/GF laminate and PTFE PCB manufacturers are under considerable pressure to address the recycling issues due to Waste Electrical and Electronic Equipment (WEEE) Directive, shortage of landfill capacity and cost of disposal. This study is proposing a novel manufacture method for reuse of the mechanical ground PTFE/Glass fibre (GF) laminate and production of the first reconstitute PTFE/GF laminate. The reconstitute PTFE/GF laminate proposed here consists of a layer of recycled sub-sheet, additional layers of PTFE and PTFE coated glass cloth, also covered by copper foils. The reconstitute PTFE/GF laminate showed good dielectric properties. Therefore, there is potential to use the mechanical ground PTFE/GF laminate powder to produce reconstitute PTFE/GF laminate, for use in high frequencies PCB applications. [ABSTRACT FROM AUTHOR]