Sintering Ag technology that shows excellent mechanical and thermal properties has become a promising solution to meet the harsh requirement of Wide Band Gap (WBG) power devices. Herein, an Ag paste contains a hybrid solvent was prepared, and its corresponding sintering profile was designed to produce robust sintered Ag joints. At a relative low temperature 150 °C, the average shear strength of sintered Ag joints can reach 49.05 MPa without pressure, which is far higher than that of traditional Sn-based solders. Robust sintered Ag joints with the highest shear strength 94.64 MPa were obtained at 230 °C. The SEM and EDS results indicate that the combining of strong internal connection and tight attachment between sintered Ag joints and substrates contributes to the high shear strength. We think the excellent results can significantly contribute to the industrial application of Ag paste in the die-attachment and realize the replacement of traditional Sn-based solders in power device packaging.