Large direct currents can flow through REBa 2 Cu 3 O 7−δ (REBCO) wires without energy loss because of zero resistance. However, they suffer from alternating current (AC) loss. To reduce AC loss, multifilamentation is effective. Motivation of this study is to expand the possibilities of multifilament technology in two points of view. One is to adapt chemical method for film deposition, other is to narrow distance between filaments. In this study, a multifilament of YBa 2 Cu 3 O 7−δ (YBCO) was fabricated using a metal−organic deposition (MOD) method on the substrates modified by a photolithography technique. As a result, a multifilament YBCO film was successfully fabricated using MOD method. Also, narrow distance between filaments in 5 μm was succeeded. These results contribute to expand process options of multifilament fabrication.