The enhanced demand for highly reliable and performant power electronic systems is ever rising. Investigation of new material systems for the use in such systems is part of many industrial and academic studies. This work discusses the thermal capabilities of inorganic encapsulation materials in power electronic modules. Several thermal simulations show the potential of this material group with regards to semiconductor junction temperatures (Tj), Those findings lead to the development of two new module concepts with enhanced cooling capabilities. The first one consists of an additionally implemented thermal path within the structure of a standard module and thus describes a drop-in solution. The second concept is designed to favor the thermal performance without maintaining the module's standard structure. Both concepts are evaluated through simulations and experiments. Furthermore, an estimation on the improved reliability through junction temperature reduction is given via lifetime models. Thermal measurements show that the first concept is able to reduce the Rth,ja by 11,9%. The second presented concept reduces the Rth,ja by 28,94% which leads to an expected elongation of lifetime by a factor of 2.6.