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1 . Conference
Reliability Performance on Fine-Pitch SoIC™ Bond
저자
by
Liang, S. W.
;
Liang, Y.R.
;
Wu, Gene C. Y.
;
Yee, K. C.
;
Wang, C. T.
, et al.
소스
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :783-787 May, 2023
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7 . Conference
High Performance and Energy Efficient Computing with Advanced SoIC™ Scaling
저자
by
Liang, S. W.
;
Wu, Gene C. Y.
;
Yee, K. C.
;
Wang, C. T.
;
Cui, Ji James
, et al.
소스
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2022 IEEE 72nd. :1090-1094 May, 2022
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7 . Conference
Wafer Level System Integration of the Fifth Generation CoWoS®-S with High Performance Si Interposer at 2500 mm2
저자
by
Huang, P. K.
;
Lu, C. Y.
;
Wei, W. H.
;
Chiu, Christine
;
Ting, K. C.
, et al.
소스
2021 IEEE 71st Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2021 IEEE 71st. :101-104 Jun, 2021
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7 . Conference
InFO_oS (Integrated Fan-Out on Substrate) Technology for Advanced Chiplet Integration
저자
by
Chiang, Y. P.
;
Tai, S. P.
;
Wu, W.C.
;
Yeh, John
;
Wang, C. T.
, et al.
소스
2021 IEEE 71st Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2021 IEEE 71st. :130-135 Jun, 2021
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7 . Conference
Applications and Reliability Study of InFO_UHD (Ultra-High-Density) Technology
저자
by
Ko, T.
;
Pu, H. P.
;
Chiang, Y.
;
Kuo, H. J.
;
Wang, C. T.
, et al.
소스
2020 IEEE 70th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2020 IEEE 70th. :1120-1125 Jun, 2020
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7 . Conference
SoIC for Low-Temperature, Multi-Layer 3D Memory Integration
저자
by
Chen, M. F.
;
Lin, C. S.
;
Liao, E. B.
;
Chiou, W. C.
;
Kuo, C. C.
, et al.
소스
2020 IEEE 70th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2020 IEEE 70th. :855-860 Jun, 2020
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7 . Conference
Design and Analysis of Logic-HBM2E Power Delivery System on CoWoS® Platform with Deep Trench Capacitor
저자
by
Chen, W. T.
;
Lin, C. C.
;
Tsai, C.H.
;
Hsia, H.
;
Ting, K. C.
, et al.
소스
2020 IEEE 70th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2020 IEEE 70th. :380-385 Jun, 2020
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7 . Conference
Systolic Building Block for Logic-on-Logic 3D-IC Implementations of Convolutional Neural Networks
저자
by
Kung, H. T.
;
McDanel, Bradley
;
Zhang, Sai Qian
;
Wang, C. T.
;
Cai, Jin
, et al.
소스
2019 IEEE International Symposium on Circuits and Systems (ISCAS) Circuits and Systems (ISCAS), 2019 IEEE International Symposium on. :1-5 May, 2019
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7 . Conference
High Performance, High Density RDL for Advanced Packaging
저자
by
Yu, C. H.
;
Yen, L. J.
;
Hsieh, C. Y.
;
Hsieh, J. S.
;
Chang, Victor C. Y.
, et al.
소스
2018 IEEE 68th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2018 IEEE 68th. :587-593 May, 2018
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7 . Conference
Immersion in Memory Compute (ImMC) Technology
저자
by
Wang, C. T.
;
Chang, W. L.
;
Chen, C. Y.
;
Yu, Douglas
.
소스
2020 IEEE Symposium on VLSI Technology VLSI Technology, 2020 IEEE Symposium on. :1-2 Jun, 2020
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