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1 . Conference
TSV fabrication technology using direct electroplating of Cu on the electroless plated barrier metal
저자
by
Shingubara, Shoso
;
Shimizu, Tomohiro
;
Matsui, Kosuke
;
Miyake, Yuko
;
Torinari, Yuichiro
, et al.
소스
2022 IEEE International Interconnect Technology Conference (IITC) Interconnect Technology Conference (IITC), 2022 IEEE International. :10-12 Jun, 2022
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7 . Conference
Low cost TSV fabrication technologies using anisotropic Si wet etching and conformal electroless plating of barrier and seed metals
저자
by
Shimizu, Tomohiro
;
Shingubara, Shoso
;
Matsui, Kosuke
;
Torinari, Yuichiro
;
Watariguchi, Shigeru
, et al.
소스
2021 IEEE International Interconnect Technology Conference (IITC) Interconnect Technology Conference (IITC), 2021 IEEE International. :1-3 Jul, 2021
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7 . Conference
Stacked Pixel Sensor/Detector Technology using Au Micro-Bump Junction
저자
by
Motoyoshi, Makoto
;
Yanagimura, Koki
;
Fushimi, Taiko
;
Endo, Shunta
.
소스
2019 International 3D Systems Integration Conference (3DIC) 3D Systems Integration Conference (3DIC), 2019 International. :1-4 Oct, 2019
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6 . Conference
CMOS 3D-Stacked FSI Multi-Channel Digital SiPM for Time-of-Flight PET Applications
저자
by
Gramuglia, Francesco
;
Muntean, Andrada
;
Venialgo, Esteban
;
Lee, Myung-Jae
;
Lindner, Scott
, et al.
소스
2020 IEEE Nuclear Science Symposium and Medical Imaging Conference (NSS/MIC) Nuclear Science Symposium and Medical Imaging Conference (NSS/MIC), 2020 IEEE. :1-3 Oct, 2020
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7 . Conference
Fully-Filled, Highly-Reliable Fine-Pitch Interposers with TSV Aspect Ratio >10 for Future 3D-LSI/IC Packaging
저자
by
Murugesan, Murugesan
;
Fukushima, Takafumi
;
Mori, Kiyoharu
;
Nakamura, Ai
;
Lee, Yisang
, et al.
소스
2019 IEEE 69th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2019 IEEE 69th. :1047-1051 May, 2019
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7 . Conference
Architecture and Characterization of a CMOS 3D-Stacked FSI Multi-Channel Digital SiPM for Time-of-Flight PET Applications
저자
by
Gramuglia, Francesco
;
Muntean, Andrada
;
Fenoglio, Carlo Alberto
;
Venialgo, Esteban
;
Lee, Myung-Jae
, et al.
소스
2021 IEEE Nuclear Science Symposium and Medical Imaging Conference (NSS/MIC) Nuclear Science Symposium and Medical Imaging Conference (NSS/MIC), 2021 IEEE. :1-2 Oct, 2021
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7 . Conference
Improving the integrity of Ti barrier layer in Cu-TSVs through self-formed TiSix for via-last TSV technology
저자
by
Mariappan, Murugesan
;
Bea, JiChel
;
Fukushima, Takafumi
;
Motoyoshi, Makoto
;
Tanaka, Tetsu
, et al.
소스
2016 IEEE International 3D Systems Integration Conference (3DIC) 3D Systems Integration Conference (3DIC), 2016 IEEE International. :1-4 Nov, 2016
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7 . Conference
3 Dimensional stacked pixel detector and sensor technology using less than 3-μmφ robust bump junctions
저자
by
Motoyoshi, Makoto
;
Yanagimura, Kohki
;
Fushimi, Taikoh
;
Takanohashi, Junichi
;
Murugesan, Mariappan
, et al.
소스
2016 IEEE International 3D Systems Integration Conference (3DIC) 3D Systems Integration Conference (3DIC), 2016 IEEE International. :1-4 Nov, 2016
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7 . Conference
3D stacked SOI-CMOS pixel detector using Au micro-bump junctions
저자
by
Motoyoshi, Makoto
;
Miyoshi, Toshinobu
;
Ikebec, Masayuki
;
Arai, Yasuo
.
소스
2016 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S) SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S), 2016 IEEE. :1-3 Oct, 2016
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6 . Conference
Three-dimensional integration technology for sensor application using 5-µm-pitch au cone bump connections
저자
by
Motoyoshi, Makoto
;
Yanagimura, Kohki
;
Takanohashi, Junichi
;
Murugesan, Mariappan
;
Aoyagi, Masahiro
, et al.
소스
2015 IEEE 65th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC) , 2015 IEEE 65th. :1365-1370 May, 2015
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