High current induced failure of ACAs flip chip joint
- Resource Type
- Conference
- Authors
- Woon-Seong Kwon; Kyung-Wook Paik
- Source
- 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345) Electronic components and technology conference Electronic Components and Technology Conference, 2002. Proceedings. 52nd. :1130-1134 2002
- Subject
- Components, Circuits, Devices and Systems
Engineered Materials, Dielectrics and Plasmas
Photonics and Electrooptics
Flip chip
Gold
Current density
Stress
Degradation
Temperature
Bonding
Substrates
Tail
Materials science and technology
- Language
- ISSN
- 0569-5503
In this paper the maximum current carrying capability of ACAs flip chip joint is investigated based on two failure mechanisms: (1) degradation of the interface between gold stud bumps and aluminum pads; and (2) ACA swelling between chips and substrates under high current stress. For the determination of the maximum allowable current, bias stressing was applied to ACAs flip chip joint. The current level at which current carrying capability is saturated is defined as the maximum allowable current. The degradation mechanism under high current stress was studied by in-situ monitoring of gold stud bump-aluminum pad ACA contact resistance and also ACA junction temperature at various current level. The cumulative failure distributions were used to predict the lifetime of ACAs flip chip joint under high current stressing. These experimental results can be used to better understand and to improve the current carrying capability of ACA flip chip joint.