Demonstration of a collective hybrid die-to-wafer integration
- Resource Type
- Conference
- Source
- 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2020 IEEE 70th. :1315-1321 Jun, 2020
- Subject
Components, Circuits, Devices and Systems Bonding Tools Resists Wafer bonding Inspection Strips Silicon Die to wafer collective hybrid bonding wafer to wafer bonding - Language
- ISSN
- 2377-5726