Room temperature SiC-SiC direct wafer bonding by SAB methods
- Resource Type
- Conference
- Source
- 2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Low Temperature Bonding for 3D Integration (LTB-3D), 2017 5th International Workshop on. :3-3 May, 2017
- Subject
Components, Circuits, Devices and Systems Engineered Materials, Dielectrics and Plasmas Photonics and Electrooptics Bonding Ion beams Standards Silicon carbide Wafer bonding Silicon - Language